Toshiba has started mass production of a new MCU (TMPM3HxF10xx) of the TXZ series advanced-grade M3H group, fabricated on a 40nm process.
In recent years, the demand for larger program capacity and support for FOTA (firmware over the air) updates has grown significantly.
The new MCU expands the maximum code flash memory capacity of the M3H group from the previous 512KB to 1MB, and the RAM capacity from 66KB to 130KB.
In its M3H product group, Toshiba now offers four code flash options and combinations of seven different packages.
Existing features such as an ARM Cortex-M3 core running up to 120MHz and 32KB data flash with 100K program/erase cycle endurance are retained.
These MCUs also offer a variety of interface and motor control options, including UART, I2C, encoders, and programmable motor drivers (PMDs).
The 1MB code Flash is implemented as two independent regions of 512KB each, allowing instructions to be read and executed from one region while updating code is programmed into the other. The zone swap feature supports firmware rotation – a key advance (along with increased memory) for these new devices.
These devices include UART, I2C, TSPI, two cell DMAC and LCD controller.
The new devices support a variety of sensing applications with high-speed, high-precision 12-bit analog-to-digital converters (ADCs), allowing two types of sample-and-hold (S&H) time input channels to be set for each of the 21 ADCs.
They are also suitable for controlling AC motors and brushless DC (BLDC) motors in combination with advanced PMD circuits that can operate synchronously with high-speed, high-precision ADCs.
The self-diagnostic functions of flash memory, RAM, ADC and clock included in the device help customers achieve IEC60730 Class B functional safety certification.